BZV55C22T1 vs BZV55C22-TP feature comparison

BZV55C22T1 Motorola Mobility LLC

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BZV55C22-TP Micro Commercial Components

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC MICRO COMMERCIAL COMPONENTS
Part Package Code DO-34 MELF
Package Description O-LELF-N2 O-LELF-R2
Pin Count 2 2
Manufacturer Package Code CASE 362-03
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-N2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 22 V 22 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form NO LEAD WRAP AROUND
Terminal Position END END
Voltage Tol-Max 5.67%
Working Test Current 5 mA 5 mA
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Additional Feature HIGH RELIABILITY
Dynamic Impedance-Max 55 Ω
JESD-609 Code e3
Knee Impedance-Max 220 Ω
Moisture Sensitivity Level 1
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) 260
Reverse Current-Max 0.0001 µA
Terminal Finish Matte Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 10

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