BZV55C18T3
vs
BZV55C18TR
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
CENTRAL SEMICONDUCTOR CORP
|
| Part Package Code |
DO-34
|
|
| Package Description |
O-LELF-N2
|
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
CASE 362-03
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
ZENER DIODE
|
| Dynamic Impedance-Max |
|
45 Ω
|
| JESD-30 Code |
|
O-LELF-R2
|
| JESD-609 Code |
|
e0
|
| Number of Elements |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
200 °C
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Polarity |
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
|
0.5 W
|
| Qualification Status |
|
Not Qualified
|
| Reference Voltage-Nom |
|
18 V
|
| Surface Mount |
|
YES
|
| Technology |
|
ZENER
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Voltage Tol-Max |
|
5%
|
| Working Test Current |
|
5 mA
|
|
|
|
Compare BZV55C18T3 with alternatives
Compare BZV55C18TR with alternatives