BZV55C12 vs BZV55C12TRL feature comparison

BZV55C12 SPC Multicomp

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BZV55C12TRL NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MULTICOMP PRO NXP SEMICONDUCTORS
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.5 W
Reference Voltage-Nom 12 V 12 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Voltage Tol-Max 5% 5%
Working Test Current 5 mA 5 mA
Base Number Matches 1 2
Pbfree Code Yes
JESD-609 Code e3
Qualification Status Not Qualified
Reverse Current-Max 0.1 µA
Terminal Finish TIN
Voltage Temp Coeff-Max 10 mV/°C

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