BZV55C10TR vs BZV55C10-TP feature comparison

BZV55C10TR Central Semiconductor Corp

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BZV55C10-TP Micro Commercial Components

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer CENTRAL SEMICONDUCTOR CORP MICRO COMMERCIAL COMPONENTS
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
Dynamic Impedance-Max 20 Ω 15 Ω
JESD-30 Code O-LELF-R2 O-LELF-R2
JESD-609 Code e0 e3
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 150 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 10 V 10 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Finish Tin/Lead (Sn/Pb) Matte Tin (Sn)
Terminal Form WRAP AROUND WRAP AROUND
Terminal Position END END
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 10
Voltage Tol-Max 5%
Working Test Current 5 mA 5 mA
Base Number Matches 1 1
Part Package Code MELF
Package Description O-LELF-R2
Pin Count 2
Samacsys Manufacturer MCC
Additional Feature HIGH RELIABILITY
Knee Impedance-Max 70 Ω
Moisture Sensitivity Level 1
Operating Temperature-Min -55 °C
Reverse Current-Max 0.0001 µA

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