BZV55C10
vs
BZV55-C10112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DO-34
Package Description
O-LELF-N2
O-LELF-R2
Pin Count
2
Manufacturer Package Code
CASE 362-03
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
JESD-30 Code
O-LELF-N2
O-LELF-R2
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
10 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN
Terminal Form
NO LEAD
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
6%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
5
1
Pbfree Code
Operating Temperature-Min
-65 °C
Reverse Current-Max
0.2 µA
Voltage Temp Coeff-Max
8 mV/°C
Compare BZV55C10 with alternatives
Compare BZV55-C10112 with alternatives