BZV55-C5V6112 vs BZV55C5V6-T feature comparison

BZV55-C5V6112 NXP Semiconductors

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BZV55C5V6-T Micro Commercial Components

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MICRO COMMERCIAL COMPONENTS
Package Description O-LELF-R2
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3 e0
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 5.6 V
Reverse Current-Max 1 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN TIN LEAD
Terminal Form WRAP AROUND
Terminal Position END
Voltage Temp Coeff-Max 2.5 mV/°C
Voltage Tol-Max 5%
Working Test Current 5 mA
Base Number Matches 1 1
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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Compare BZV55C5V6-T with alternatives