BZV55-C39135
vs
BZV55C39
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
O-LELF-R2
O-LELF-R2
Reach Compliance Code
unknown
compliant
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
NOT SPECIFIED
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
39 V
39 V
Reverse Current-Max
0.05 µA
0.05 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
40
30
Voltage Temp Coeff-Max
41.2 mV/°C
41.2 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
2 mA
2 mA
Base Number Matches
2
10
Rohs Code
Pin Count
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
130 Ω
Compare BZV55-C39135 with alternatives
Compare BZV55C39 with alternatives