BZV55-C2V4
vs
BZV55-B2V4
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
2
Reach Compliance Code
compliant
compliant
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
100 Ω
100 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.4 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
2.4 V
2.4 V
Reverse Current-Max
50 µA
50 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
Tin (Sn)
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
30
30
Voltage Temp Coeff-Max
Voltage Tol-Max
5%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
11
9
Compare BZV55-C2V4 with alternatives
Compare BZV55-B2V4 with alternatives