BZV55-C11,115
vs
BZV55C11L1G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
End Of Life
Ihs Manufacturer
NXP SEMICONDUCTORS
TAIWAN SEMICONDUCTOR CO LTD
Part Package Code
MELF
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Manufacturer Package Code
SOD80C
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
20 Ω
20 Ω
JESD-30 Code
O-LELF-R2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
Operating Temperature-Max
200 °C
175 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
11 V
11 V
Reverse Current-Max
0.1 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
MATTE TIN OVER NICKEL
Terminal Form
WRAP AROUND
Terminal Position
END
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
9 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
2
1
Compare BZV55-C11,115 with alternatives
Compare BZV55C11L1G with alternatives