BZV55-B9V1,115
vs
933827740115
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
MELF
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
O-LELF-R2
Pin Count
2
Manufacturer Package Code
SOD80C
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
e3
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.4 W
Qualification Status
Not Qualified
Reference Voltage-Nom
9.1 V
9.1 V
Reverse Current-Max
0.5 µA
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN
TIN
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
30
30
Voltage Temp Coeff-Max
7 mV/°C
Voltage Tol-Max
2%
2%
Working Test Current
5 mA
5 mA
Base Number Matches
2
2
Reference Standard
IEC-60134
Compare BZV55-B9V1,115 with alternatives
BZV55-B9V1,115 vs BZV55-B9V1112
BZV55-B9V1,115 vs BZV55-B9V1135
BZV55-B9V1,115 vs BZV55-B9V1,135
BZV55-B9V1,115 vs BZV55-B9V1
BZV55-B9V1,115 vs BZT52H-C9V1
BZV55-B9V1,115 vs BZT52H-C9V1,135
BZV55-B9V1,115 vs BZT52H-C9V1,115
BZV55-B9V1,115 vs BZT52-C9V1-7
BZV55-B9V1,115 vs MMSZ9V1T3
Compare 933827740115 with alternatives