BZV55-B7V5,115
vs
BZV55C7V5P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
parentfamilyid
1075975
Ihs Manufacturer
NXP SEMICONDUCTORS
MICRO COMMERCIAL COMPONENTS
Part Package Code
MELF
MELF
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
MINIMELF-2
Pin Count
2
2
Manufacturer Package Code
SOD80C
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Factory Lead Time
4 Weeks
Total Weight
34.02
Category CO2 Kg
8.7
8.54
CO2
295.974
Compliance Temperature Grade
Military: -65C to +200C
EU RoHS Version
RoHS 2 (2015/863/EU)
EU RoHS Exemptions
7(c)-I
Candidate List Date
2024-06-27
CAS Accounted for Wt
100
CA Prop 65 Presence
YES
CA Prop 65 CAS Numbers
1333-86-4, 7440-48-4, 7440-02-0, 1309-64-4, 1317-36-8
Conflict Mineral Status
DRC Conflict Free
Conflict Mineral Status Source
CMRT V4.20
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
Dynamic Impedance-Max
15 Ω
JESD-30 Code
O-LELF-R2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
Number of Terminals
2
Operating Temperature-Max
200 °C
Operating Temperature-Min
-65 °C
Package Body Material
GLASS
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
Qualification Status
Not Qualified
Reference Voltage-Nom
7.5 V
Reverse Current-Max
1 µA
Surface Mount
YES
Technology
ZENER
Terminal Finish
TIN
Terminal Form
WRAP AROUND
Terminal Position
END
Time@Peak Reflow Temperature-Max (s)
30
Voltage Temp Coeff-Max
5.3 mV/°C
Voltage Tol-Max
2%
Working Test Current
5 mA
Base Number Matches
2
1
Pbfree Code
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