BZV55-B3V6,135
vs
BZT52-B3V6
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Package Description
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
R-PDSO-G2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
150 °C
Operating Temperature-Min
-65 °C
-55 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.4 W
0.35 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Voltage Tol-Max
2%
1.94%
Working Test Current
5 mA
5 mA
Base Number Matches
2
3
JESD-609 Code
e3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Reference Standard
AEC-Q101; IEC-60134
Terminal Finish
TIN
Time@Peak Reflow Temperature-Max (s)
30
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