BZV55-B3V6,135 vs BZT52-B3V6 feature comparison

BZV55-B3V6,135 NXP Semiconductors

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BZT52-B3V6 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2 R-PDSO-G2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 200 °C 150 °C
Operating Temperature-Min -65 °C -55 °C
Package Body Material GLASS PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style LONG FORM SMALL OUTLINE
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 0.4 W 0.35 W
Qualification Status Not Qualified
Reference Voltage-Nom 3.6 V 3.6 V
Surface Mount YES YES
Technology ZENER ZENER
Terminal Form WRAP AROUND GULL WING
Terminal Position END DUAL
Voltage Tol-Max 2% 1.94%
Working Test Current 5 mA 5 mA
Base Number Matches 2 3
JESD-609 Code e3
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Reference Standard AEC-Q101; IEC-60134
Terminal Finish TIN
Time@Peak Reflow Temperature-Max (s) 30

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