BZT55C5V1L1
vs
1N5993BURE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
End Of Life
Transferred
Ihs Manufacturer
TAIWAN SEMICONDUCTOR CO LTD
MICROSEMI CORP
Package Description
ROHS COMPLIANT, HERMETIC SEALED, GLASS, LS34, QUADRO MINIMELF-2
O-LELF-R2
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Samacsys Manufacturer
Taiwan Semiconductor
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
35 Ω
JEDEC-95 Code
DO-213AA
DO-213AA
JESD-30 Code
O-LELF-R2
O-LELF-R2
JESD-609 Code
e3
Knee Impedance-Max
550 Ω
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
5.1 V
5.1 V
Reverse Current-Max
0.1 µA
Reverse Test Voltage
1 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
MATTE TIN OVER NICKEL
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5%
5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
1
Additional Feature
METALLURGICALLY BONDED
Compare BZT55C5V1L1 with alternatives
Compare 1N5993BURE3 with alternatives