BZT55C43
vs
JAN1N4994CUS
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
LITE-ON SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
MELF
Package Description
O-LELF-R2
HERMETIC SEALED, GLASS PACKAGE-2
Pin Count
2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
LOW NOISE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
43 V
330 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Form
WRAP AROUND
WRAP AROUND
Terminal Position
END
END
Voltage Tol-Max
6.977%
2%
Working Test Current
2.5 mA
4 mA
Base Number Matches
1
1
Rohs Code
Factory Lead Time
28 Weeks
JESD-609 Code
e0
Reference Standard
MIL-19500/356H
Terminal Finish
Tin/Lead (Sn/Pb)
Compare BZT55C43 with alternatives
Compare JAN1N4994CUS with alternatives