BZT55C2V4-B0L1G
vs
MLL5985BUR
feature comparison
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TAIWAN SEMICONDUCTOR CO LTD
|
MICROSEMI CORP
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Case Connection |
ISOLATED
|
ISOLATED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
85 Ω
|
|
JEDEC-95 Code |
DO-213AA
|
DO-213AA
|
JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e0
|
Knee Impedance-Max |
600 Ω
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
175 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
GLASS
|
GLASS
|
Package Shape |
ROUND
|
ROUND
|
Package Style |
LONG FORM
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.5 W
|
0.5 W
|
Reference Voltage-Nom |
2.4 V
|
2.4 V
|
Reverse Current-Max |
50 µA
|
|
Reverse Test Voltage |
1 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
MATTE TIN OVER NICKEL
|
TIN LEAD
|
Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
Terminal Position |
END
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Tol-Max |
5%
|
5%
|
Working Test Current |
5 mA
|
5 mA
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
No
|
Part Package Code |
|
DO-213AA
|
Package Description |
|
O-LELF-R2
|
Pin Count |
|
2
|
Additional Feature |
|
METALLURGICALLY BONDED
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare BZT55C2V4-B0L1G with alternatives
Compare MLL5985BUR with alternatives