BZT52H-C3V6
vs
JANHCA1N5519C
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
COMPENSATED DEVICES INC
Package Description
PLASTIC PACKAGE-2
DIE-2
Pin Count
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8541.10.00.50
Samacsys Manufacturer
NXP
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
500 Ω
JESD-30 Code
R-PDSO-F2
S-XXUC-N2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.375 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
3.6 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
Terminal Form
FLAT
NO LEAD
Terminal Position
DUAL
UNSPECIFIED
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
5.56%
2%
Working Test Current
5 mA
20 mA
Base Number Matches
2
3
Additional Feature
METALLURGICALLY BONDED
Case Connection
CATHODE
Reference Standard
MIL-19500/437E
Compare BZT52H-C3V6 with alternatives
Compare JANHCA1N5519C with alternatives