BZT52H-C27
vs
BZV55-C27
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FAGOR ELECTRONICA S COOP
|
Package Description |
PLASTIC PACKAGE-2
|
GLASS, MINI MELF-2
|
Pin Count |
2
|
2
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
250 Ω
|
80 Ω
|
JESD-30 Code |
R-PDSO-F2
|
O-LELF-R2
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
SMALL OUTLINE
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.375 W
|
0.4 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
27 V
|
27 V
|
Surface Mount |
YES
|
YES
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
Terminal Form |
FLAT
|
WRAP AROUND
|
Terminal Position |
DUAL
|
END
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Tol-Max |
7.04%
|
5%
|
Working Test Current |
2 mA
|
2 mA
|
Base Number Matches |
2
|
9
|
Part Package Code |
|
MELF
|
Case Connection |
|
ISOLATED
|
Operating Temperature-Min |
|
-65 °C
|
|
|
|
Compare BZT52H-C27 with alternatives
Compare BZV55-C27 with alternatives