BZT52H-C13
vs
MQ1N5243CUR-1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROSEMI CORP
|
Package Description |
PLASTIC PACKAGE-2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.50
|
8541.10.00.50
|
Configuration |
SINGLE
|
|
Diode Element Material |
SILICON
|
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
110 Ω
|
|
JESD-30 Code |
R-PDSO-F2
|
|
JESD-609 Code |
e3
|
e0
|
Moisture Sensitivity Level |
1
|
|
Number of Elements |
1
|
|
Number of Terminals |
2
|
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
SMALL OUTLINE
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
|
Power Dissipation-Max |
0.375 W
|
|
Qualification Status |
Not Qualified
|
|
Reference Voltage-Nom |
13.25 V
|
|
Surface Mount |
YES
|
|
Technology |
ZENER
|
|
Terminal Finish |
Tin (Sn)
|
TIN LEAD
|
Terminal Form |
FLAT
|
|
Terminal Position |
DUAL
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Tol-Max |
6.42%
|
|
Working Test Current |
5 mA
|
|
Base Number Matches |
2
|
1
|
|
|
|
Compare BZT52H-C13 with alternatives
Compare MQ1N5243CUR-1 with alternatives