BZT52H-C13
vs
1N964DRL
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
PLASTIC PACKAGE-2
O-LALF-W2
Pin Count
2
2
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
110 Ω
JESD-30 Code
R-PDSO-F2
O-LALF-W2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
200 °C
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
SMALL OUTLINE
LONG FORM
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.375 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
13.25 V
13 V
Surface Mount
YES
NO
Technology
ZENER
ZENER
Terminal Finish
Tin (Sn)
Terminal Form
FLAT
WIRE
Terminal Position
DUAL
AXIAL
Time@Peak Reflow Temperature-Max (s)
30
Voltage Tol-Max
6.42%
1%
Working Test Current
5 mA
9.5 mA
Base Number Matches
2
2
Part Package Code
DO-35
Manufacturer Package Code
CASE 299
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
JEDEC-95 Code
DO-204AH
Knee Impedance-Max
700 Ω
Operating Temperature-Min
-65 °C
Reverse Current-Max
5 µA
Compare BZT52H-C13 with alternatives
Compare 1N964DRL with alternatives