BZT52C3V6LP-7
vs
JAN1N5519B-1
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
DIODES INC
|
MICROSEMI CORP
|
Part Package Code |
DFN
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8541.10.00.50
|
|
Factory Lead Time |
8 Weeks
|
|
Samacsys Manufacturer |
Diodes Incorporated
|
|
Additional Feature |
HIGH RELIABILITY
|
METALLURGICALLY BONDED
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
ZENER DIODE
|
ZENER DIODE
|
Dynamic Impedance-Max |
90 Ω
|
|
JESD-30 Code |
R-PBCC-N2
|
O-LALF-W2
|
JESD-609 Code |
e4
|
e0
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
175 °C
|
Operating Temperature-Min |
-65 °C
|
-65 °C
|
Package Body Material |
PLASTIC/EPOXY
|
GLASS
|
Package Shape |
RECTANGULAR
|
ROUND
|
Package Style |
CHIP CARRIER
|
LONG FORM
|
Peak Reflow Temperature (Cel) |
260
|
|
Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
Power Dissipation-Max |
0.25 W
|
0.5 W
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Voltage-Nom |
3.6 V
|
3.6 V
|
Surface Mount |
YES
|
NO
|
Technology |
ZENER
|
ZENER
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
WIRE
|
Terminal Position |
BOTTOM
|
AXIAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Voltage Tol-Max |
5.56%
|
5%
|
Working Test Current |
5 mA
|
20 mA
|
Base Number Matches |
1
|
8
|
Package Description |
|
HERMETIC SEALED, GLASS, DO-35, 2 PIN
|
Case Connection |
|
ISOLATED
|
JEDEC-95 Code |
|
DO-204AH
|
Reference Standard |
|
MIL-19500
|
|
|
|
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