BZM55C9V1
vs
HZU9.1B2
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
HITACHI LTD
|
| Part Package Code |
MELF
|
|
| Package Description |
O-LELF-R2
|
R-PDSO-G2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| Dynamic Impedance-Max |
10 Ω
|
30 Ω
|
| JESD-30 Code |
O-LELF-R2
|
R-PDSO-G2
|
| JESD-609 Code |
e0
|
|
| Knee Impedance-Max |
50 Ω
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.2 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
9.6 V
|
9.04 V
|
| Reverse Current-Max |
0.0001 µA
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
WRAP AROUND
|
GULL WING
|
| Terminal Position |
END
|
DUAL
|
| Voltage Tol-Max |
6.08%
|
2.1%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
10
|
2
|
| Operating Temperature-Max |
|
150 °C
|
|
|
|
Compare BZM55C9V1 with alternatives
Compare HZU9.1B2 with alternatives