BZM55C3V9-TP
vs
BZM55C3V9-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRO COMMERCIAL COMPONENTS
MICRO COMMERCIAL COMPONENTS
Part Package Code
MELF
Package Description
R-PELF-R2
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Case Connection
ISOLATED
Configuration
SINGLE
Diode Element Material
SILICON
Diode Type
ZENER DIODE
JESD-30 Code
O-LELF-R2
JESD-609 Code
e3
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
Number of Terminals
2
Package Body Material
PLASTIC/EPOXY
Package Shape
ROUND
Package Style
LONG FORM
Peak Reflow Temperature (Cel)
260
240
Polarity
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
Qualification Status
Not Qualified
Reference Voltage-Nom
3.9 V
Surface Mount
YES
Technology
ZENER
Terminal Finish
Matte Tin (Sn)
TIN LEAD
Terminal Form
WRAP AROUND
Terminal Position
END
Time@Peak Reflow Temperature-Max (s)
10
30
Voltage Tol-Max
5%
Working Test Current
20 mA
Base Number Matches
1
2
Compare BZM55C3V9-TP with alternatives
Compare BZM55C3V9-T with alternatives