BZM55C3V6TR
vs
HZM10NB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
VISHAY TELEFUNKEN
HITACHI LTD
Part Package Code
MELF
Package Description
HERMETIC SEALED, MICROMELF-2
R-PDSO-G3
Pin Count
2
Reach Compliance Code
unknown
unknown
Additional Feature
LOW NOISE
Case Connection
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LELF-R2
R-PDSO-G3
JESD-609 Code
e2
Moisture Sensitivity Level
1
Number of Elements
1
1
Number of Terminals
2
3
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.2 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.6 V
10 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN SILVER
Terminal Form
WRAP AROUND
GULL WING
Terminal Position
END
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Voltage Tol-Max
5.556%
5.5%
Working Test Current
5 mA
5 mA
Base Number Matches
1
2
ECCN Code
EAR99
HTS Code
8541.10.00.50
Dynamic Impedance-Max
30 Ω
Operating Temperature-Max
150 °C
Reverse Current-Max
2 µA
Compare BZM55C3V6TR with alternatives
Compare HZM10NB with alternatives