BZM55C3V0P vs MMSZ3V9 feature comparison

BZM55C3V0P Micro Commercial Components

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MMSZ3V9 EIC Semiconductor Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS EIC SEMICONDUCTOR CO LTD
Part Package Code MELF
Package Description HERMETIC SEALED, MICROMELF-2
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W
Qualification Status Not Qualified
Reference Voltage-Nom 3 V
Surface Mount YES
Technology ZENER
Terminal Finish MATTE TIN
Terminal Form WRAP AROUND
Terminal Position END
Voltage Tol-Max 6.67%
Working Test Current 5 mA
Base Number Matches 1 6
Pbfree Code Yes

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