BZM55C24P
vs
BZX284-C24,115
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRO COMMERCIAL COMPONENTS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
MELF
|
|
| Package Description |
O-LELF-R2
|
R-CDSO-R2
|
| Pin Count |
2
|
2
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.50
|
8541.10.00.50
|
| Case Connection |
ISOLATED
|
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
ZENER DIODE
|
ZENER DIODE
|
| JESD-30 Code |
O-LELF-R2
|
R-CDSO-R2
|
| JESD-609 Code |
e3
|
e2
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Package Body Material |
GLASS
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
ROUND
|
RECTANGULAR
|
| Package Style |
LONG FORM
|
SMALL OUTLINE
|
| Polarity |
UNIDIRECTIONAL
|
UNIDIRECTIONAL
|
| Power Dissipation-Max |
0.5 W
|
0.4 W
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reference Voltage-Nom |
24 V
|
24 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ZENER
|
ZENER
|
| Terminal Finish |
MATTE TIN
|
TIN COPPER
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
DUAL
|
| Voltage Tol-Max |
5.79%
|
5%
|
| Working Test Current |
5 mA
|
5 mA
|
| Base Number Matches |
1
|
1
|
| Dynamic Impedance-Max |
|
250 Ω
|
| Operating Temperature-Max |
|
150 °C
|
|
|
|
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