BZM55C10-TP vs BZX384-C2V7 feature comparison

BZM55C10-TP Micro Commercial Components

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BZX384-C2V7 Philips Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRO COMMERCIAL COMPONENTS PHILIPS SEMICONDUCTORS
Part Package Code MELF
Package Description R-PELF-R2
Pin Count 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LELF-R2
JESD-609 Code e3 e3
Moisture Sensitivity Level 1
Number of Elements 1 1
Number of Terminals 2
Package Body Material PLASTIC/EPOXY
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260 260
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.5 W 0.3 W
Qualification Status Not Qualified
Reference Voltage-Nom 10 V 2.7 V
Surface Mount YES YES
Technology ZENER
Terminal Finish Matte Tin (Sn) MATTE TIN
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 10
Voltage Tol-Max 5% 5%
Working Test Current 10 mA 5 mA
Base Number Matches 1 4
Dynamic Impedance-Max 600 Ω
Operating Temperature-Max 150 °C

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