BZD27-C47/T3
vs
SMAJP4KE47AE3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MICROSEMI CORP
Package Description
O-LELF-R2
PLASTIC, DO-214BA, SMAJ, 2 PIN
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Breakdown Voltage-Min
44 V
44.7 V
Case Connection
ISOLATED
Clamping Voltage-Max
65.5 V
64.8 V
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
TRANS VOLTAGE SUPPRESSOR DIODE
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 Code
O-LELF-R2
R-PDSO-C2
JESD-609 Code
e3
Moisture Sensitivity Level
1
Non-rep Peak Rev Power Dis-Max
300 W
400 W
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
150 °C
Package Body Material
GLASS
PLASTIC/EPOXY
Package Shape
ROUND
RECTANGULAR
Package Style
LONG FORM
SMALL OUTLINE
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.8 W
1.52 W
Qualification Status
Not Qualified
Not Qualified
Reverse Current-Max
5 µA
Surface Mount
YES
YES
Technology
AVALANCHE
AVALANCHE
Terminal Finish
TIN
Terminal Form
WRAP AROUND
C BEND
Terminal Position
END
DUAL
Base Number Matches
1
10
Part Package Code
DO-214AC
Pin Count
2
Breakdown Voltage-Max
49.4 V
Breakdown Voltage-Nom
47 V
JEDEC-95 Code
DO-214AC
Operating Temperature-Min
-65 °C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Rep Pk Reverse Voltage-Max
40.2 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare BZD27-C47/T3 with alternatives
Compare SMAJP4KE47AE3 with alternatives