BYW99P-200
vs
MBR30200PTC0G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TAIWAN SEMICONDUCTOR CO LTD
|
| Package Description |
PLASTIC PACKAGE-3
|
TO-3P, 3 PIN
|
| Pin Count |
3
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Samacsys Manufacturer |
STMicroelectronics
|
|
| Additional Feature |
FREE WHEELING DIODE
|
LOW POWER LOSS
|
| Application |
EFFICIENCY
|
EFFICIENCY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
COMMON CATHODE, 2 ELEMENTS
|
COMMON CATHODE, 2 ELEMENTS
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
1.1 V
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| Non-rep Pk Forward Current-Max |
200 A
|
200 A
|
| Number of Elements |
2
|
2
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Current-Max |
15 A
|
15 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Power Dissipation-Max |
30 W
|
|
| Qualification Status |
Not Qualified
|
|
| Rep Pk Reverse Voltage-Max |
200 V
|
200 V
|
| Reverse Current-Max |
15 µA
|
100 µA
|
| Reverse Recovery Time-Max |
0.04 µs
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
AVALANCHE
|
SCHOTTKY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
10
|
| Base Number Matches |
1
|
1
|
| JEDEC-95 Code |
|
TO-247AD
|
| JESD-609 Code |
|
e3
|
| Reference Standard |
|
UL RECOGNIZED
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare BYW99P-200 with alternatives
Compare MBR30200PTC0G with alternatives