BYM12-300HE3_A/I
vs
1N5621US
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
VISHAY INTERTECHNOLOGY INC
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Date Of Intro |
2017-08-19
|
|
| Additional Feature |
FREE WHEELING DIODE, HIGH RELIABILITY
|
HIGH RELIABILITY
|
| Application |
EFFICIENCY
|
|
| Breakdown Voltage-Min |
300 V
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.25 V
|
|
| JEDEC-95 Code |
DO-213AB
|
|
| JESD-30 Code |
O-LELF-R2
|
O-LELF-R2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Non-rep Pk Forward Current-Max |
30 A
|
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
175 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Output Current-Max |
1 A
|
1 A
|
| Package Body Material |
GLASS
|
GLASS
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
LONG FORM
|
LONG FORM
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Reference Standard |
AEC-Q101
|
|
| Rep Pk Reverse Voltage-Max |
300 V
|
|
| Reverse Current-Max |
5 µA
|
|
| Reverse Recovery Time-Max |
0.05 µs
|
0.3 µs
|
| Reverse Test Voltage |
300 V
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN LEAD
|
| Terminal Form |
WRAP AROUND
|
WRAP AROUND
|
| Terminal Position |
END
|
END
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
No
|
| Package Description |
|
HERMETIC SEALED, GLASS, D-5A, 2 PIN
|
| Pin Count |
|
2
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Qualification Status |
|
Not Qualified
|
|
|
|
Compare BYM12-300HE3_A/I with alternatives
Compare 1N5621US with alternatives