BYM10-1000
vs
DL4007
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
GENERAL INSTRUMENT CORP
|
MICROSEMI CORP
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| Part Package Code |
|
MELF
|
| Package Description |
|
MELF-2
|
| Pin Count |
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8541.10.00.80
|
| Additional Feature |
|
METALLURGICALLY BONDED
|
| Case Connection |
|
ISOLATED
|
| Configuration |
|
SINGLE
|
| Diode Element Material |
|
SILICON
|
| Diode Type |
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
|
1.1 V
|
| JESD-30 Code |
|
O-LELF-R2
|
| JESD-609 Code |
|
e0
|
| Non-rep Pk Forward Current-Max |
|
30 A
|
| Number of Elements |
|
1
|
| Number of Phases |
|
1
|
| Number of Terminals |
|
2
|
| Operating Temperature-Max |
|
150 °C
|
| Output Current-Max |
|
1 A
|
| Package Body Material |
|
GLASS
|
| Package Shape |
|
ROUND
|
| Package Style |
|
LONG FORM
|
| Qualification Status |
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
|
1000 V
|
| Reverse Recovery Time-Max |
|
2 µs
|
| Surface Mount |
|
YES
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
|
WRAP AROUND
|
| Terminal Position |
|
END
|
|
|
|
Compare BYM10-1000 with alternatives
Compare DL4007 with alternatives