BYC8-600,127
vs
BYR29-600
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
WEEN SEMICONDUCTORS CO LTD
NXP SEMICONDUCTORS
Package Description
PLASTIC PACKAGE-3/2
R-PSFM-T2
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
Samacsys Manufacturer
WeEn Semiconductors
Application
HYPER FAST RECOVERY POWER
ULTRA FAST SOFT RECOVERY
Case Connection
CATHODE
CATHODE
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
RECTIFIER DIODE
RECTIFIER DIODE
Forward Voltage-Max (VF)
2.9 V
1.6 V
JEDEC-95 Code
TO-220AC
TO-220AC
JESD-30 Code
R-PSFM-T2
R-PSFM-T2
JESD-609 Code
e3
e3
Non-rep Pk Forward Current-Max
60 A
66 A
Number of Elements
1
1
Number of Phases
1
1
Number of Terminals
2
2
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Peak Reflow Temperature (Cel)
260
260
Reference Standard
IEC-60134
Rep Pk Reverse Voltage-Max
600 V
600 V
Reverse Current-Max
150 µA
Reverse Recovery Time-Max
0.052 µs
0.075 µs
Surface Mount
NO
NO
Terminal Finish
TIN
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
2
5
Pbfree Code
Yes
Part Package Code
TO-220AC
Pin Count
3
HTS Code
8541.10.00.80
Output Current-Max
8 A
Qualification Status
Not Qualified
Compare BYC8-600,127 with alternatives
Compare BYR29-600 with alternatives