BYC20-600,127
vs
BYC20-600
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
WEEN SEMICONDUCTORS CO LTD
|
| Part Package Code |
TO-220
|
|
| Package Description |
PLASTIC PACKAGE-2
|
PLASTIC PACKAGE-2
|
| Pin Count |
2
|
|
| Manufacturer Package Code |
SOD59
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8541.10.00.70
|
8541.10.00.80
|
| Factory Lead Time |
4 Weeks
|
|
| Application |
HYPER FAST RECOVERY
|
HYPER FAST RECOVERY
|
| Case Connection |
CATHODE
|
CATHODE
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
| Forward Voltage-Max (VF) |
1.97 V
|
2.9 V
|
| JEDEC-95 Code |
TO-220AC
|
TO-220AC
|
| JESD-30 Code |
R-PSFM-T2
|
R-PSFM-T2
|
| JESD-609 Code |
e3
|
e3
|
| Non-rep Pk Forward Current-Max |
274 A
|
274 A
|
| Number of Elements |
1
|
1
|
| Number of Phases |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Output Current-Max |
20 A
|
20 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Rep Pk Reverse Voltage-Max |
600 V
|
600 V
|
| Reverse Recovery Time-Max |
0.055 µs
|
0.055 µs
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
TIN
|
Tin (Sn)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
2
|
| ECCN Code |
|
EAR99
|
| Reference Standard |
|
IEC-60134
|
| Reverse Current-Max |
|
200 µA
|
|
|
|