BX805555080P
vs
BX80574E5430P
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEL CORP
|
INTEL CORP
|
| Part Package Code |
LGA
|
LGA
|
| Package Description |
BGA, LGA771,30X33,46/43
|
,
|
| Pin Count |
771
|
771
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A991.A.1
|
3A991.A.1
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
34
|
|
| Bit Size |
64
|
|
| Boundary Scan |
YES
|
|
| Clock Frequency-Max |
266 MHz
|
|
| External Data Bus Width |
64
|
|
| Format |
FLOATING POINT
|
|
| Integrated Cache |
YES
|
|
| JESD-30 Code |
X-XBGA-B771
|
S-PBGA-B771
|
| Low Power Mode |
YES
|
|
| Number of Terminals |
771
|
771
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
|
| Package Equivalence Code |
LGA771,30X33,46/43
|
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
3730 MHz
|
|
| Supply Current-Max |
150000 mA
|
|
| Supply Voltage-Nom |
1.2 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.1 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare BX805555080P with alternatives
Compare BX80574E5430P with alternatives