BUZ341 vs SSH40N20 feature comparison

BUZ341 Siemens

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SSH40N20 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer SIEMENS A G SAMSUNG SEMICONDUCTOR INC
Package Description FLANGE MOUNT, R-PSFM-T3 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95
Avalanche Energy Rating (Eas) 790 mJ
Configuration SINGLE SINGLE
DS Breakdown Voltage-Min 200 V 200 V
Drain Current-Max (ID) 33 A 40 A
Drain-source On Resistance-Max 0.07 Ω 0.08 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 350 pF
JEDEC-95 Code TO-218
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e0
Number of Elements 1 1
Number of Terminals 3 3
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation Ambient-Max 170 W
Power Dissipation-Max (Abs) 170 W 230 W
Pulsed Drain Current-Max (IDM) 132 A
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Turn-off Time-Max (toff) 920 ns
Turn-on Time-Max (ton) 230 ns
Base Number Matches 1 2
Part Package Code TO-3P
Pin Count 3

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