BUZ341
vs
SSH40N20
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
SIEMENS A G
SAMSUNG SEMICONDUCTOR INC
Package Description
FLANGE MOUNT, R-PSFM-T3
FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.95
Avalanche Energy Rating (Eas)
790 mJ
Configuration
SINGLE
SINGLE
DS Breakdown Voltage-Min
200 V
200 V
Drain Current-Max (ID)
33 A
40 A
Drain-source On Resistance-Max
0.07 Ω
0.08 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss)
350 pF
JEDEC-95 Code
TO-218
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
JESD-609 Code
e0
Number of Elements
1
1
Number of Terminals
3
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation Ambient-Max
170 W
Power Dissipation-Max (Abs)
170 W
230 W
Pulsed Drain Current-Max (IDM)
132 A
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
Transistor Element Material
SILICON
SILICON
Turn-off Time-Max (toff)
920 ns
Turn-on Time-Max (ton)
230 ns
Base Number Matches
1
2
Part Package Code
TO-3P
Pin Count
3
Compare BUZ341 with alternatives
Compare SSH40N20 with alternatives