BUX66C vs BD241 feature comparison

BUX66C Harris Semiconductor

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BD241 Crimson Semiconductor Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR CRIMSON SEMICONDUCTOR INC
Package Description FLANGE MOUNT, O-MBFM-P2 FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.95 8541.29.00.95
Case Connection COLLECTOR
Collector Current-Max (IC) 2 A 3 A
Collector-Base Capacitance-Max 220 pF
Collector-Emitter Voltage-Max 350 V 45 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 10 25
JEDEC-95 Code TO-213AA TO-220AB
JESD-30 Code O-MBFM-P2 R-PSFM-T3
JESD-609 Code e0 e0
Number of Elements 1 1
Number of Terminals 2 3
Operating Temperature-Max 200 °C 150 °C
Package Body Material METAL PLASTIC/EPOXY
Package Shape ROUND RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type PNP NPN
Power Dissipation Ambient-Max 35 W 40 W
Power Dissipation-Max (Abs) 35 W 40 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG THROUGH-HOLE
Terminal Position BOTTOM SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Transition Frequency-Nom (fT) 20 MHz 2 MHz
Turn-off Time-Max (toff) 3100 ns
VCEsat-Max 2.5 V 1.2 V
Base Number Matches 1 4

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