BUV48
vs
TIP31C
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
MICROSEMI CORP
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
PLASTIC, TO-220, 3 PIN
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
|
| Case Connection |
COLLECTOR
|
|
| Collector Current-Max (IC) |
15 A
|
3 A
|
| Collector-Base Capacitance-Max |
350 pF
|
|
| Collector-Emitter Voltage-Max |
400 V
|
100 V
|
| Configuration |
SINGLE
|
|
| DC Current Gain-Min (hFE) |
8
|
10
|
| JEDEC-95 Code |
TO-218
|
TO-220
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| JESD-609 Code |
e0
|
e0
|
| Number of Elements |
1
|
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
175 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
NPN
|
NPN
|
| Power Dissipation Ambient-Max |
150 W
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
2400 ns
|
|
| Turn-on Time-Max (ton) |
900 ns
|
|
| VCEsat-Max |
5 V
|
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SFM
|
| Pin Count |
|
3
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
|
|
|
Compare BUV48 with alternatives
Compare TIP31C with alternatives