BUS50.MODR1
vs
BUS50
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SEMELAB LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
BFM
Package Description
FLANGE MOUNT, O-MBFM-P2
,
Pin Count
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
Case Connection
COLLECTOR
Collector Current-Max (IC)
70 A
70 A
Collector-Emitter Voltage-Max
125 V
Configuration
SINGLE
Single
DC Current Gain-Min (hFE)
20
20
JEDEC-95 Code
TO-204AE
JESD-30 Code
O-MBFM-P2
JESD-609 Code
e1
Number of Elements
1
Number of Terminals
2
Package Body Material
METAL
Package Shape
ROUND
Package Style
FLANGE MOUNT
Polarity/Channel Type
NPN
NPN
Qualification Status
Not Qualified
Surface Mount
NO
NO
Terminal Finish
TIN SILVER COPPER
Terminal Form
PIN/PEG
Terminal Position
BOTTOM
Transistor Element Material
SILICON
Base Number Matches
2
6
Operating Temperature-Max
200 °C
Power Dissipation-Max (Abs)
350 W
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