BUK553-100B
vs
APT8090BN
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MICROSEMI CORP
|
| Part Package Code |
TO-220AB
|
TO-247AD
|
| Package Description |
FLANGE MOUNT, R-PSFM-T3
|
TO-247AD, 3 PIN
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.29.00.95
|
|
| Additional Feature |
LOGIC LEVEL COMPATIBLE
|
|
| Avalanche Energy Rating (Eas) |
70 mJ
|
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
100 V
|
800 V
|
| Drain Current-Max (ID) |
12 A
|
12 A
|
| Drain-source On Resistance-Max |
0.22 Ω
|
0.9 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| Feedback Cap-Max (Crss) |
120 pF
|
|
| JEDEC-95 Code |
TO-220AB
|
TO-247AD
|
| JESD-30 Code |
R-PSFM-T3
|
R-PSFM-T3
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
175 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Power Dissipation Ambient-Max |
75 W
|
|
| Power Dissipation-Max (Abs) |
75 W
|
310 W
|
| Pulsed Drain Current-Max (IDM) |
48 A
|
48 A
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Transistor Application |
SWITCHING
|
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Max (toff) |
170 ns
|
|
| Turn-on Time-Max (ton) |
80 ns
|
|
| Base Number Matches |
3
|
2
|
| Pbfree Code |
|
No
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare BUK553-100B with alternatives
Compare APT8090BN with alternatives