BUK551-100A vs BUK455-100A feature comparison

BUK551-100A North American Philips Discrete Products Div

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BUK455-100A NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NORTH AMERICAN PHILIPS DISCRETE PRODUCTS DIV NXP SEMICONDUCTORS
Package Description , FLANGE MOUNT, R-PSFM-T3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
Configuration SINGLE SINGLE WITH BUILT-IN DIODE
Drain Current-Max (ID) 3 A 26 A
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-609 Code e0
Number of Elements 1 1
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 175 °C 175 °C
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 40 W 125 W
Surface Mount NO NO
Terminal Finish Tin/Lead (Sn/Pb)
Base Number Matches 3 3
Part Package Code TO-220AB
Pin Count 3
HTS Code 8541.29.00.95
Avalanche Energy Rating (Eas) 100 mJ
Case Connection DRAIN
DS Breakdown Voltage-Min 100 V
Drain-source On Resistance-Max 0.08 Ω
Feedback Cap-Max (Crss) 150 pF
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
Number of Terminals 3
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Dissipation Ambient-Max 125 W
Pulsed Drain Current-Max (IDM) 104 A
Qualification Status Not Qualified
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 240 ns
Turn-on Time-Max (ton) 70 ns

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