BUJ105AD
vs
BUJD105AD
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
WEEN SEMICONDUCTORS CO LTD
|
Part Package Code |
TO-252AA
|
|
Package Description |
SMALL OUTLINE, R-PSSO-G2
|
SC-63, DPAK-3
|
Pin Count |
3
|
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
Case Connection |
COLLECTOR
|
COLLECTOR
|
Collector Current-Max (IC) |
8 A
|
8 A
|
Collector-Emitter Voltage-Max |
400 V
|
400 V
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
DC Current Gain-Min (hFE) |
13
|
8
|
JEDEC-95 Code |
TO-252AA
|
TO-252
|
JESD-30 Code |
R-PSSO-G2
|
R-PSSO-G2
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
1
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Polarity/Channel Type |
NPN
|
NPN
|
Power Dissipation-Max (Abs) |
80 W
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
TIN
|
Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Position |
SINGLE
|
SINGLE
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
3
|
2
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare BUJ105AD with alternatives
Compare BUJD105AD with alternatives