BUJ103AX,127 vs BU2515AF feature comparison

BUJ103AX,127 NXP Semiconductors

Buy Now Datasheet

BU2515AF NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TO-220 SFM
Package Description PLASTIC, SOT-186A, 3 PIN FLANGE MOUNT, R-PSFM-T3
Pin Count 3 3
Manufacturer Package Code SOT186A SOT199
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.29.00.75 8541.29.00.95
Factory Lead Time 4 Weeks
Case Connection ISOLATED ISOLATED
Collector Current-Max (IC) 4 A 9 A
Collector-Emitter Voltage-Max 400 V 800 V
Configuration SINGLE SINGLE
DC Current Gain-Min (hFE) 12 5
JESD-30 Code R-PSFM-T3 R-PSFM-T3
JESD-609 Code e3
Number of Elements 1 1
Number of Terminals 3 3
Operating Temperature-Max 150 °C 150 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT FLANGE MOUNT
Polarity/Channel Type NPN NPN
Power Dissipation-Max (Abs) 26 W
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Terminal Finish TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 1 1
Power Dissipation Ambient-Max 45 W
Turn-off Time-Max (toff) 3400 ns
VCEsat-Max 5 V

Compare BUJ103AX,127 with alternatives

Compare BU2515AF with alternatives