BU8242F-E2
vs
UAA2077AM
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ROHM CO LTD
|
NXP SEMICONDUCTORS
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP,
|
LSSOP, SSOP20,.25
|
Pin Count |
20
|
20
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e3/e2
|
|
Length |
12.5 mm
|
6.5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
-25 °C
|
-30 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
LSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.9 mm
|
1.5 mm
|
Supply Current-Max |
8 mA
|
33.5 mA
|
Supply Voltage-Nom |
5 V
|
4 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
Terminal Finish |
TIN/TIN COPPER
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
10
|
|
Width |
5.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
2
|
Package Equivalence Code |
|
SSOP20,.25
|
Technology |
|
BICMOS
|
|
|
|
Compare BU8242F-E2 with alternatives
Compare UAA2077AM with alternatives