BU8242F-DXE1
vs
U2763B-AFN
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROHM CO LTD
|
TELEFUNKEN MICROELECTRONICS GMBH
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
12.5 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
20
|
20
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.01 mm
|
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
CORDLESS TELEPHONE SUPPORT CIRCUIT
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.4 mm
|
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
SSOP20,.25
|
| Supply Voltage-Nom |
|
3 V
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare BU8242F-DXE1 with alternatives