BU4S66-TL vs TC4S66FU feature comparison

BU4S66-TL ROHM Semiconductor

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TC4S66FU Toshiba America Electronic Components

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD TOSHIBA CORP
Part Package Code SOIC SSOP
Package Description LSSOP, TSSOP, TSSOP5/6,.08
Pin Count 5 5
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2.9 mm 2 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 5 5
On-state Resistance-Max (Ron) 950 Ω 950 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.1 mm
Supply Voltage-Max (Vsup) 16 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 100 ns 80 ns
Switch-on Time-Max 80 ns 120 ns
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.95 mm 0.65 mm
Terminal Position DUAL DUAL
Width 1.6 mm 1.25 mm
Base Number Matches 1 1
Rohs Code Yes
Samacsys Manufacturer Toshiba
Input Voltage-Max 18 V
Input Voltage-Min
Normal Position NO
Package Equivalence Code TSSOP5/6,.08
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Nom (Vsup) 5 V
Switching BREAK-BEFORE-MAKE
Technology CMOS
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare BU4S66-TL with alternatives

Compare TC4S66FU with alternatives