BU4551B
vs
BU4551BF-E2
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
DIP, DIP16,.3
|
ROHS COMPLIANT, SOP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
ROHM Semiconductor
|
ROHM Semiconductor
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e2
|
|
| Length |
19.4 mm
|
10 mm
|
| Number of Channels |
2
|
2
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| On-state Resistance Match-Nom |
25 Ω
|
25 Ω
|
| On-state Resistance-Max (Ron) |
1100 Ω
|
1100 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
SOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.55 mm
|
1.6 mm
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
13
|
2
|
| Factory Lead Time |
|
7 Weeks
|
|
|
|
Compare BU4551B with alternatives
Compare BU4551BF-E2 with alternatives