BU4522AF
vs
BUJ303AX
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
Case Connection
ISOLATED
ISOLATED
Collector Current-Max (IC)
10 A
5 A
Collector-Emitter Voltage-Max
800 V
500 V
Configuration
SINGLE
SINGLE
DC Current Gain-Min (hFE)
4.2
14
JESD-30 Code
R-PSFM-T3
R-PSFM-T3
JESD-609 Code
e3
e3
Number of Elements
1
1
Number of Terminals
3
3
Operating Temperature-Max
150 °C
150 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLANGE MOUNT
FLANGE MOUNT
Polarity/Channel Type
NPN
NPN
Power Dissipation-Max (Abs)
45 W
32 W
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Terminal Finish
TIN
TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
SINGLE
SINGLE
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
3
3
Part Package Code
SFM
Package Description
PLASTIC, SOT-186A, 3 PIN
Pin Count
3
Manufacturer Package Code
SOT186A
Compare BU4522AF with alternatives
Compare BUJ303AX with alternatives