BU4309F
vs
BU4309F-TR
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Not Recommended
|
| Ihs Manufacturer |
ROHM CO LTD
|
ROHM CO LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
TSOP, TSOP4,.08
|
TSOP, TSSOP4/6,.08
|
| Pin Count |
4
|
4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BAT BUP SW:N;MNL RST:N;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:Y;UV DET:N;WD:N;WWD:N
|
Terminal Pitch between Pin 1 to Pin 2 is 1.25
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
| JESD-30 Code |
R-PDSO-G4
|
R-PDSO-G4
|
| JESD-609 Code |
e2
|
|
| Length |
2 mm
|
2 mm
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-25 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSOP
|
TSOP
|
| Package Equivalence Code |
TSOP4,.08
|
TSSOP4/6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.05 mm
|
1.05 mm
|
| Supply Voltage-Min (Vsup) |
0.9 V
|
0.7 V
|
| Supply Voltage-Nom (Vsup) |
2.4 V
|
0.85 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Copper (Sn/Cu)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.3 mm
|
1.3 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Threshold Voltage-Nom |
+0.9V
|
+0.9V
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
4
|
1
|
| Samacsys Manufacturer |
|
ROHM Semiconductor
|
|
|
|