BU4094BC vs BU4094BCF-T1 feature comparison

BU4094BC ROHM Semiconductor

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BU4094BCF-T1 ROHM Semiconductor

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD ROHM CO LTD
Part Package Code DIP SOIC
Package Description DIP, DIP16,.3 SOP-16
Pin Count 16 16
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer ROHM Semiconductor
Additional Feature COMPLIMENTARY SERIAL OUTPUT ALSO AVAILABLE PARALLEL OUTPUT IS LATCHED; UNLATCHED SERIAL SHIFT RIGHT OUTPUT
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e2 e2
Length 19.4 mm 10 mm
Load Capacitance (CL) 50 pF
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN PARALLEL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP LSOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 840 ns 840 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.55 mm 1.6 mm
Supply Voltage-Max (Vsup) 18 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Copper (Sn/Cu) TIN COPPER
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 4.4 mm
fmax-Min 3 MHz
Base Number Matches 12 1

Compare BU4094BC with alternatives

Compare BU4094BCF-T1 with alternatives