BU4069UBFV-E1 vs HEF4069UBTT feature comparison

BU4069UBFV-E1 ROHM Semiconductor

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HEF4069UBTT NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer ROHM CO LTD NXP SEMICONDUCTORS
Part Package Code SSOP TSSOP
Package Description LSSOP, TSSOP14,.25 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e2 e4
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP TSSOP
Package Equivalence Code TSSOP14,.25 TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TUBE
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.35 mm 1.1 mm
Supply Voltage-Max (Vsup) 16 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish TIN COPPER Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 1 2
Max I(ol) 0.00035999999999999997 A
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 90 ns
Propagation Delay (tpd) 90 ns
Time@Peak Reflow Temperature-Max (s) 30

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