BU4013B
vs
M38510H05151BCX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ROHM CO LTD
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
DIP,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDIP-T14
R-GDIP-T14
Length
19.4 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
1
1
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
175 ns
825 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.5 mm
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
14 MHz
1 MHz
Base Number Matches
1
2
Screening Level
MIL-PRF-38535 Class B
Supply Voltage-Max (Vsup)
15 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
10 V
Total Dose
1M Rad(Si) V
Compare BU4013B with alternatives
Compare M38510H05151BCX with alternatives